MICRO perforation LASER system model LASER ONE for 40µm to 200µm holes and pre-cuts
Description
This equipment is designed to make MICRO HOLES through laser sources on moving films of various materials and thicknesses and is to be inserted as a host unit in film processing lines, such as in slitters, extruders, packaging machines, printing and welding machines. The LASER-ONE model guarantees perfect micro holes even on multi-layer, single or bi-oriented laminated materials.
It is ideal for delicate processing such as MICRO-PERFORATION and SCORING on packages for the IV AND V RANGE, for MAP PACKS and EMAP PACKS. With the holes made by this device, air exchange with the outside of the packages can be controlled. By inducing CONTROLLED PERMEABILITY, it is possible, for example, to increase the SHELF LIFE of all fresh products.
Operation
The running film, held in perfect tension by the idler rollers, arrives at the device and is perforated by the CO2 LASER through the emission of BEAMS OF LIGHT WITH INFRARED FREQUENCY. These beams are subsequently "combed" and expanded by the BEAM EXPANDER. The light beams are then focused on a reduced and circumscribed film surface by means of a FOCUSING LENS. Micro-perforation is achieved by sublimation of the material, caused by the heat of the laser beam.
Operation and Adjustment
OPERATION and ADJUSTMENT of the LASER-ONE is entrusted to our software with 4.0 predisposition. From the electrical control panel, the operator, via touch screen, manages all operations inherent to the device such as adjusting the laser pulses, diameter and position of the holes. With the laser, it is possible to both MAKE HOLES and WEAKEN THE MATERIAL in depth, reducing the thickness of the film, without perforating it. This process, called scoring, is ideal, for example, for creating easy openings.
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PE - LDPE - HDPE - PP - BOPP - CPP - PLA - NON WOVEN - LAMINATES - FOOD GRADE PVC
| TECHNICAL DATA SHEET | |
|---|---|
| Product | Laser Unit |
| Laser Source Type | CO2 laser source with 10 years of service before gas refill |
| Hole Ø | Min. Ø40µm - Max. Ø200µm |
| Maximum Speed | 400* meters/minute |
| Maximum power of the laser source | 360W* |
| Control system | Control panel with custom PLC and PC with remote assistance |
| Software | 4.0 integration and recipe management (insertion, storage, recall) |
| Cooling system | Water |
| Accessories | Encoder and Photocell |
| * | Value influenced by the type of processed material and machine configuration |
| OPTIONALS |
|---|
| Camera |
| Fume Suction |
| Idler Rollers |
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