Scanning Heads in Laser perforation

Laser perforation technology, also referred to as MAP perforation , is distinguished by its precision and ability to create complex configurations with improved aesthetic and functional characteristics.

Technological advantages of laser perforation

Unlike standard mechanical perforation practices, laser drilling for packaging presents considerable advancements in:

• Advanced Precision: Laser perforation is software-controlled, allowing continuous modulation of hole size according to process parameters, without interruptions or tool changes. This allows waste and defects to be minimized during production.

• Material integrity: The laser's controlled thermal energy reduces mechanical stresses on the substrate, maintaining the film's structural properties.

• Precise control of gas and moisture flow:
  Laser-created microholes (as low as 40µm) make it possible to adjust the permeability of the packaging and protect the finished product from contaminants, even in the case of small (single-dose) packages.

Galvanometric scanners for laser positioning

Galvanometer technology is crucial for the dynamic control of the laser beam. A galvanometer system employs mirrors mounted on rotating shafts, electromagnetically driven through coils that modulate angular position.

Dual-axis configurations, with perpendicularly oriented mirrors, allow the beam to be directed anywhere in a two-dimensional plane. To ensure accurate focusing, specific optics such as F-theta lenses are used to ensure uniform focus over the entire processing area.

This approach significantly increases processing speed compared to mechanical techniques, making laser drilling a superior solution due to higher productivity and less material waste production.

Conclusions

Laser scanning systems optimize beam positioning with high speed, thus ensuring faster work and better competitiveness.

Spark Machinery Solution

Spark Machinery's LO-S 40 is designed for microperforation on single and bi-oriented multilayer films. Ideal for microperforating and scoring applications on IV and V range, MAP and EMAP packages, this system ensures superior quality as well as faster processing in the most demanding processes.

OPERATION and ADJUSTMENT of the LO-S 40 is entrusted to our software with 4.0 readiness. From the control touch screen, the operator manages all operations inherent to the device such as adjusting laser pulses, diameter and hole position. The electronics are set up with a PC through which the operator can control each scanning head and decide the working pattern.

With Spark Machinery, technological innovation results in industrial solutions of high precision and maximum efficiency.

Contact our Sales Office at info@sparkmachinery.com for consultation, carry out tests, feasibility studies, and for any information!